XG-5100 series products are reactive interfacial thermally conductive filler materials made of silicone resin and nanometer thermally conductive fillers with high thermal conductivity and extrudability, which can meet the needs of manual dispensing or dispensing operations using dispensing equipment, and provide cushioning, vibration damping and heat dissipation for electronic components.
Product Description
XG-5100 series products are divided into two components, A and B. After mixing, it can be cured quickly at room temperature or by heating, and after curing, it forms a soft thermally conductive elastomer, which does not cause stress damage to electronic components. At the same time, the product has good wettability, can cover the microscopic uneven surface, so as to make full contact with the mating parts to improve the efficiency of heat conduction, is a good heat conduction material between the high-power devices and heat sinks shaped interface.
Typical Application
Communication equipment, terminal equipment, consumer electronics, network equipment, security equipment, optical communication modules, automotive electronics, modular power supply, battery packs and other applications to meet the heat dissipation applications between high-power devices and heat sinks.
Features and Benefits
● High extrusion rate, can meet the automatic dispensing process
● Soft, low stress, no stress damage to the device
● High thermal conductivity, low thermal resistance, thermal conductivity 1.5~8W/(m·k)
● Ageing resistance, no drying out
● Operating temperature -40~150℃
● Compliance with RoHS and REACH directives
Packaging
50cc/group, 200cc/group, 400cc/group, 25kg/5 gallon bucket.
FAQ
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