XG-5400 series thermally conductive clay is a silicone-based thermally conductive thermal filler with a thermal conductivity of 1.0-5.0W/(m-K), low interfacial thermal resistance and high plasticity, no curing is required, and it is used to fill the gap between heat generating surfaces and heat dissipating surfaces where the gap is large and irregular.
Product Description
XG-5400 series of thermally conductive mud to silicone resin as a substrate, add thermally conductive filler and bonding materials in a certain proportion of configuration, and through a special process from the mastic material, has a low interface thermal resistance and strong plasticity, the thickness of the requirements of complex environments with large changes in the ability to effectively fit a variety of uneven interface gaps, and at the same time has a high temperature does not share the oil, does not dry, does not solidify the characteristics of high temperature to meet the reliability of the working conditions. Reliability in high temperature working condition.
Typical Application
Power supply modules, LED lighting, thermal management components, motor controllers, mass storage modules, and communication hardware fill large gaps with heat sink housings.
Features and Benefits
● High thermal conductivity, low thermal resistance, low stress, low modulus
● Rubberized clay, high plasticity, good adhesion
● Certain adhesive strength, no flow, extrudable
● No need for curing, no deformation when no pressure is applied, good vibration resistance, easy reworking
● Excellent resistance to high and low temperatures, weathering, and aging.
● Flame retardant up to UL94 V-0, RoHS and REACH compliant
Packaging
1kg/drum, 2kg/drum 5kg/drum, 25kg/drum
FAQ
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