XG-8200 TF is a flame-retardant one-component deethanolized room temperature curing silicone sealant with fast surface drying and curing speed, non-toxic and environmentally friendly, mainly used in the power supply PCB component bonding, fixing, charger in the electronic components of the bonding fixed.
Description
XG-8200 TF is a one-component organosilicon deethanolized room temperature curing sealant, easy to use, does not contain organic tin, fast curing, adjustable viscosity, good adhesion to many substrates, no need for primer; anti-vibration, preventing mechanical damage, no corrosion of the substrate, good chemical stability, weathering resistance, electrical insulation and high electrical strength.
Typical Application
Widely used in PC power supply, Adapter, charger, set-top box, router, smart meter PCB board components bonding fixed.
Features and Benefits
● Paste, adjustable viscosity
● Single-component room temperature moisture curing, de-alcoholized type.
● Good adhesion to a wide range of substrates, no primer required.
● No organic tin, non-toxic and environmentally friendly.
● Comply with RoHS, REACH and other directives.
● Working temperature -50~200℃, excellent weather resistance.
Packaging
100ml/pc,100pcs/ctn
300ml/branch,25pcs/box
2600ml/staff,4/carton
5 gallons/barrel
FAQ
About electronic adhesive to solve the problem
About Us
More details about our electronic adhesive
