XG-8300 SP series products have low viscosity, good leveling, and good adhesion to metals and plastics.
Product Description
XG-8300 SP series products are low viscosity, good leveling, good adhesion to metals and plastics, short curing time, widely used in electronic components, waterproof potting, insulation and circuit board protection, modules, optical display potting protection.
Typical Application
Shallow potting of electronic components against moisture and water (less than 6mm), electronic modules, photoelectric displays, circuit board potting protection
Features and Benefits
● Flow type, less than 6mm shallow potting sealing
● Adjustable viscosity, to meet the requirements of different applications of potting and waterproofing
● Room temperature moisture curing type, good elasticity of the colloid
● Good waterproof performance, good adhesion to most metals, glass and plastics.
● Excellent weatherability
Packaging
100ml/pc,100pcs/ctn
300ml/pc, 25pcs/box
FAQ
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