XG-5200 series products are one-component pre-cured, low volatility and low assembly stress new thermally conductive interfacial filler materials, no need to re-mix and cure, easy to use, and reliable thermally conductive heat dissipation materials.
Product Description
XG-5200 series products are one-component silicone-based thermally conductive interfacial fillers, commonly known as one-component thermally conductive gels, which have been delivered fully cured, so that customers do not need an additional curing process when using them. Single component thermally conductive gels are very flexible and are suitable for use in small space structures and between electronic components where low mechanical stress is required. One-component thermally conductive gels have good thermal conductivity, with a thermal conductivity of 2 to 10 W/m-K. They also have good extrudability and can be dispensed on dispensing equipment with high operational convenience and efficiency.
Typical Application
Cell phones, tablets, laptops and other mobile terminals, LED lighting, between chips and heat dissipation modules, wearable devices, drone devices, communication equipment, network terminal equipment, new energy batteries, automotive industry.
Features and Benefits
● High extrusion rate to meet automatic dispensing process
● Soft, low stress, no stress damage to the device
● Easy to use, no need for mixing and curing
● High thermal conductivity, low volatility, aging resistance, no drying out
● Operating temperature -40~150℃
● Compliance with RoHS and REACH directives
Packaging
Syringe packaging: 30cc, 55cc, 300cc, or customized packaging according to customer requirements.
FAQ
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