XG-6100 T15 series products are room temperature or temperature curing two-component molding silicone potting adhesive, designed for a variety of high-power electronic components, modular power supply, electronic control module thermal conductivity and heat dissipation design, so that high-power electronic components to easily deal with the thermal management problems.
Description
XG-6100 T15 series silicone potting compound, as a high-performance heat dissipation material, has excellent thermal conductivity, both electrical properties, aging resistance, high and low temperature resistance, waterproof moisture resistance, commonly used in electronic or other types of products potting heat dissipation, potting sealing, encapsulation protection, insulation and moisture.
Typical Application
PD fast charging, new energy vehicle power supply and controller potting heat dissipation protection
Features and Benefits
● High thermal conductivity and flame retardant.
● Reworkability, components can be removed for repair and replacement after potting.
● Waterproof and moisture-proof, anti-vibration, anti-leakage
● High and low temperature impact resistance, aging resistance
● Comply with EU RoHS, REACH and other directives.
● -50~200℃ long term performance
Packaging
Component A: 10kg/drum, 25kg/drum
Component B: 10kg/drum, 25kg/drum
FAQ
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