XG-8200 HT series products are environmentally friendly silicone bonding adhesive, both adhesive function, but also has excellent thermal conductivity (heat dissipation) and flame retardant properties, long-term use does not fall off, will not produce contact gaps to reduce the effect of heat dissipation.
Product Description
XG-8200 HT series products are one-component silicone deethanolized room temperature curing adhesive, good adhesion to metals and most plastics, excellent resistance to hot and cold alternating properties after curing, excellent thermal conductivity and flame retardant properties, can be used for electrical modules and heat sinks between the filler, instead of the traditional way of connecting the card and screws, to bring a more reliable adhesive, filler and heat dissipation, to provide a more simple to use! It provides more reliable bonding, filling and heat dissipation effect, simpler use and more economical cost.
Typical Application
Replacing thermally conductive silicone grease for filling and bonding between CPU and heat sink, thyristor intelligent control module and heat sink, high power electrical module and heat sink, automotive IC, amplifier IC, image IC and heat sink, transformer and heat sink or shell.
Features and Benefits
● Paste, adjustable viscosity
● One-component room temperature moisture curing, de-ethanolized type
● Thermal conductivity 1.0/1.5/2.0 W/(m-k)
● Good thermal conductivity, flame retardant up to UL94 V-0.
● Comply with RoHS, REACH and other directives.
● Working temperature -50~200℃, excellent weather resistance.
Packaging
100ml/pc,100pcs/ctn
300ml/branch,25pcs/box
2600ml/staff,4/carton
5 gallons/barrel
FAQ
About electronic adhesive to solve the problem
About us
More details about our electronic adhesive
