High performance sealants for industrial electronics XG-8200 is an adhesive sealant designed for bonding applications that require high strength and elasticity, allowing for primerless bonding of a wide range of materials including enameled steel, aluminum, ceramics, glass and some engineering plastics, as well as use as a form-in-place gasket (FIPG).
Description
High performance sealants for industrial electronics ，XG-8200 is a one-component organosilicon de-alcoholized room temperature curing sealant, this product has good adhesion to aluminum, copper, stainless steel and other metals and PC, ABS, superior dielectric properties, good heat resistance, the general use of temperature range -50 ℃ ~ 200 ℃. Curing process is released during the alcohol substances, polycarbonate (PC), copper and other materials without corrosion, in full compliance with the EU RoHS Directive requirements.
Typical Application
Enameled steel, aluminum, ceramics, glass, PC, ABS and other engineering plastics bonding, or do in situ forming gasket (FIPG) use
Features and Benefits
● Paste, non-sagging
● One-component room temperature moisture curing, de-alcoholized type
● Excellent adhesion to most substrates.
● High bond strength, good elasticity of the gel
● Comply with RoHS, REACH and other directives.
● Working temperature -50~200℃, excellent weather resistance.
100ml/pc,100pcs/ctn;
300ml/branch,25pcs/box;
2600ml/staff,4/carton;
5 gallons/barrel.
FAQ
About electronic adhesive to solve the problem
About Us
More details about our electronic adhesive
