XG-8100 series products are single-component room temperature curing organosilicon sealant, applicable to a variety of metal to metal, metal and non-metallic materials between the bonding, sealing.
Product Description
XG-8100 series products are single-component room temperature curing deethanolized silicone sealant, room temperature and trace moisture in the air reaction curing, curing to form a flexible elastomer. After curing, it has excellent high and low temperature resistance, good electrical insulation properties, aging resistance, moisture resistance, and good adhesive properties.
Typical Application
Bonding and sealing of electronic components, semiconductor materials, electronic appliances and other equipment. Bonding of electronic instrument housings, insulation protection of micro motors, bonding and sealing of electronic components.
Features and Benefits
● Viscous colloid, viscosity adjustable
● Single-component room temperature moisture curing, de-alcoholization type
● Solvent-free, non-corrosive, aging resistance
● Excellent electrical insulation and weather resistance, can be used at -40~200℃.
Packaging
50ml/pc,100pcs/ctn
100ml/branch,100pcs/box
300ml/branch,25pcs/box
2600ml/branch, 4pcs/box
FAQ
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