XG6100AD is a general-purpose two-component additive molding silicone potting compound with adhesion to the substrate, mainly used in outdoor or humid environments that require dustproof and waterproof level of IP67 or above, thermal conductivity and flame retardant potting of electronic devices.
Product Description
XG-6100FR series silicone potting compound, with excellent fire retardant and flame retardant properties and a variety of features, its excellent electrical insulation properties, can effectively protect the electronic and electrical equipment, to avoid injury to personnel and equipment damage due to electric shock and other reasons. Secondly, it has strong chemical resistance and temperature resistance, which can effectively protect the equipment in various harsh environments. In addition, it also has good adhesive properties and wear-resistant performance, reliable fixed equipment and extend the service life.
Packaging
Component A: 10kg/drum, 25kg/drum
Component B: 10kg/drum, 25kg/drum
Features and Benefits
● Low viscosity, self-leveling, excellent caulking ability
● Adapt to manual or machine filling, can be repaired after filling.
● Waterproof and moisture-proof, anti-vibration, anti-leakage
● Certain adhesion to PC, ABS, aluminum and other substrates.
● Comply with EU RoHS, REACH and other directives.
● -50~200℃ long term performance.
Typical Application
Driver power supply, module power supply, switching power supply, etc. Dustproof and waterproof grade IP67 or above protection grade potting
FAQ
About electronic adhesive to solve the problem
About us
More details about our electronic adhesive
