The main properties of potting compound include waterproof and moisture-proof, dustproof and corrosion-proof, insulating and heat-conducting, shockproof and pressure-resistant, temperature-resistant and weather-resistant, etc. It is a widely used protective material in the manufacture of electronic components. It provides a solid guarantee for the long-term stable operation of electronic products with excellent performance.
It is coated or encapsulated on the surface of electronic components to form a dense layer of protection, which can effectively prevent the intrusion of water, moisture, dust and corrosive substances, thus significantly improving the waterproof and moisture-proof, dust-proof and corrosion-resistant capabilities of electronic components, and prolonging their service life.
Performance of potting compounds：
Waterproof and moisture-proof: After curing, the potting compound can effectively prevent the intrusion of water and moisture, and improve the waterproof and moisture-proof performance of electronic components.
Dust and corrosion: After curing, the potting compound will form a dense protective layer, which can effectively block the intrusion of dust and corrosive substances, and extend the service life of electronic components.
Insulation and thermal conductivity: potting compound has excellent insulation properties, can effectively prevent electrical short circuit. Part of the potting compound also has good thermal conductivity, which helps to dissipate heat.
Anti-vibration and anti-pressure: Potting compound can strengthen the integrity of electronic devices, effectively resist the impact of external shock and vibration. At the same time, by reinforcing the internal structure, but also to enhance the compressive properties of electronic devices, to ensure that electronic devices in all kinds of harsh environments can maintain stable operation.
Temperature and weather resistance: potting adhesive can withstand high and low temperature changes within a certain range, and some products can even maintain stable performance at extreme temperatures. It also has good weathering properties, can resist ozone and ultraviolet degradation.
The use of potting compound process.
1. Surface treatment: Before potting, it is usually necessary to clean and pre-treat the surface of the electronic components to remove dust, oil, moisture and other impurities to ensure that the surface is dry, clean and flat.
2. Mixing and stirring: If the potting compound is two-component, it is necessary to mix the two components in accordance with the ratio of the operating instructions, and stir sufficiently to ensure uniform mixing to ensure the curing effect.
3. Filling: use the appropriate tools, such as syringes, glue guns, etc., will be mixed potting adhesive slowly and evenly potted to the parts to be potting, to ensure complete coverage of the components and fill the gaps.
4. Eliminate air bubbles: In the filling process, air bubbles may be generated. Can be static, vacuum defoaming or vibration and other ways to eliminate air bubbles to ensure the quality of potting.
5. Curing: According to the characteristics of the potting compound and environmental conditions, let it cure at the appropriate temperature and humidity. Curing time varies from product to product and instructions should be strictly followed.
6. Trimming: After curing, check the potting surface and trim and polish if necessary.
The performance and use of potting compound is a fine and complex process, in the use of potting compound in the whole process to keep the operating environment clean and dry, to ensure that the potting compound is mixed evenly, and according to the use of potting compound process, meticulous filling to avoid bubbles and leakage of filling, to ensure that the effect of potting to achieve the best state, and to effectively avoid a variety of potential problems occurring.
