Potting compound curing time is the entire process from the time it is potted onto a component until it is fully cured to form a protective barrier. This process is complex and divided into stages, mainly including operation time, initial curing time and complete curing time.
Operation time: refers to the potting adhesive two components in proportion to the mixing of uniform, to the glue is difficult to level the construction of the time period;
Initial solid time: potting adhesive filling and start reaction, to achieve the initial molding but not yet have the hardness of the state of the time required;
Complete curing time: potting adhesive overall state of stability, the time required for complete curing.
Test methods for potting compound curing time
Isogravimetric method: calculating the curing time of a potting compound by monitoring the change in its weight over time;
Modulus of elasticity method: to determine the change in the modulus of elasticity of the potting compound under a specific pressure, so as to determine its curing time;
Factors affecting the curing time of potting compound
Potting compound curing time directly affects production efficiency and product quality, the following are the main factors:
Temperature: the higher the temperature, the faster the curing speed, and vice versa is slow;
Humidity: high humidity environment, the curing speed may slow down, the curing effect may also be affected;
Thickness: the thicker the potting adhesive layer, the longer the curing time;
Wettability: good wettability helps to shorten the curing time.
In addition, air flow, light and other environmental factors may also have a certain impact on the potting adhesive curing time. In practical application, these factors need to be considered comprehensively and optimized according to the specific circumstances, in order to achieve the best curing effect and product performance.
