Potting compounds are polymer fine composite special potting materials. They are used to protect electronic components and equipment from environmental influences by pouring or filling them around electronic components, improving mechanical strength and giving excellent electrical insulation properties.
Potting compounds are liquid and fluid before curing, and the viscosity of the adhesive varies according to the material, performance and production process of the product.
Potting adhesive completely cured to achieve its use value, cured can play a waterproof moisture, dust, insulation, thermal conductivity, confidentiality, anti-corrosion, temperature resistance, shockproof role.
Electronic potting compound types, its chemical composition and performance are different. At present, the main three common silicone resin potting compound, epoxy resin potting compound, polyurethane potting compound.
1. Silicone potting compounds:
A class of electronic potting compound made of silicone rubber, including one-component silicone potting compound and two-component silicone potting compound. Silicone potting compound is generally soft and elastic, with excellent high and low temperature resistance and electrical insulation properties. Suitable for extreme temperature environments and require a high degree of electrical insulation applications.
2. Epoxy Potting Compounds：
Generally consists of bisphenol A epoxy resin, curing agent (amine or anhydride), reinforcing additives and fillers. It has excellent mechanical strength, adhesion and chemical resistance. It is suitable for applications requiring high strength protection.
3. Urethane Potting Compounds：
Also known as PU potting Compound, the main components are polybenzyl diisocyanate and polyether polyol in the presence of catalyst (triethylene diamine) crosslinking curing, the formation of polymers. Has good elasticity and impact resistance, suitable for use in the need for wear-resistant, shock-resistant and flexible protection occasions.
XG Electronic Silicone offers a wide range of electronic potting materials with various functions and characteristics. Each type of potting compound is designed for a wide range of applications and can be selected according to specific application scenarios.
